Technology | 28 nm HPM |
Package | FCBGA33*33 |
Wafer Foundry | TSMC |
Assembly vendor | Spil-TW |
Final Test ATE | 93 K |
CP Yield | 73.6% |
Die Size | 10.710 mm*11.907 mm |
CPU Max Frequency | 1.4 GHz |
Total Power | 19.8 W |